68 innovations

IBM cools chips with H2O

IBM Labs is taking water cooling to another level, and pumping waterinto each layer of a semiconductor via pipes as thin as a human hair.

IBM said that its researchers, along with Fraunhofer Institute inBerlin, demonstrated a prototype that integrates a water cooling systemdirection into 3-D semiconductors. In a nutshell, IBM is pumping "tinyrivers of water" into the stacks of circuits and components. Theresearch team was led by Thomas Brunschwiler, project leader at IBM’sZurich Research Laboratory.

Source: blogs.zdnet.comAdded: 5 June 2008